Improve the shortcomings of semiconductor equipment automation

Automation challenge of semiconductor equipmentFor the high-end manufacturing industry such as semiconductor equipment, whether it is the front equipment around wafer manufacturing or the back equipment such as material equipment and sealing and testing, the precision and reliability of the process are the most important.Therefore, the semiconductor industry has a wide demand for high precision (including repetitive positioning accuracy) and high reliability automatic control technology. For example, in MOCVD (Metal Organic Chemical Vapor Deposition) reactor, the temperature and pressure of gas in the reactor chamber and the time/temperature distribution of the substrate need to be accurately controlled, so that ultra-pure semiconductor materials can be well deposited on the surface of the substrate to form a thin metal film, and then a blank wafer can be made.Secondly, some high-speed semiconductor devices, such as mask aligner, wafer cutting machine and mounter, need high enough data transmission speed and processing capacity to support them. For example, accurate laser positioning in mask aligner requires high sampling rate, short cycle time (about 50 µs) and stable real-time capability.Third, cost and flexibility. For millions of semiconductor manufacturing equipment, modular control system design can not only realize the versatility and flexibility of the equipment, but also further help customers control costs by saving space and reducing wiring.How to improve the pain point of equipment automation?Innovative automation solutions have been applied to oxidation/diffusion equipment, lithography equipment, etching equipment, cleaning equipment, ion implantation equipment, thin film deposition equipment, mechanical polishing equipment and subsequent test and packaging equipment, etc., effectively improving some automation pain points of domestic semiconductor equipment, such as:Semiconductor devices need to be connected with various instruments, valves and other external devices, and the bus type is complex, which requires a lot of communication programming work;Semiconductor equipment manufacturers need to develop customized hardware products such as circuit boards themselves, and the workload of electrical development is heavy;

Semiconductor equipment manufacturers need high-speed bus communication to connect all components and realize the transmission of large data communication parameters.