The Mini LED Wafer AOI Equipment is used in the post-sorting stage. It replaces manual visual inspection for sorted chip sources, enabling visual inspection of sorted chips and quick direct removal of defective dies.
Equipment Introduction
The Mini LED Wafer AOI Equipment is used in the post-sorting stage. It replaces manual visual inspection for sorted chip sources, enabling visual inspection of sorted chips and quick direct removal of defective dies.
Equipment Highlights
①. Key Point-focused Inspection: Our wafer inspection equipment focuses on detecting issues such as appearance defects, misalignment, angular skew, and floating dies. By using advanced visual algorithms and image processing technology, it can accurately identify and mark these defects, helping the production line detect and resolve potential quality issues in a timely manner;
②. Rapid Defective Chip Sorting: The equipment is equipped with a high-speed sorting robotic arm. Once defective chips are detected, it can quickly and accurately separate them from the wafer, ensuring only high-quality chips enter the next production process. This greatly improves production efficiency and reduces the inflow of defective products;
③. Replacing Quality Inspectors: The inspection equipment has the ability to fully replace quality inspectors in the post-sorting stage. The automated inspection and sorting system reduces the demand for human resources, offers advantages in accuracy and consistency, and reduces misjudgments and missed inspections caused by human factors, improving the efficiency and stability of the production line;
④. Doubled Inspection Efficiency: By adopting advanced inspection algorithms and high-speed image processing technology, the inspection efficiency of this wafer inspection equipment is doubled compared to other visual inspection equipment on the market. This improves overall production efficiency and profits, and significantly shortens the production cycle.
Application Scenarios
Wafer: Compatible with 4-inch and 6-inch wafers, supporting mother-child rings and iron rings;
Chips: Compatible with 2mil-80mil chips and packaged chips;
Non-destructive connection for automatic loading and unloading
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