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芯片半导体设备
Mini LED Wafer AOI Equipment
Mini LED芯片分选机
Mini LED芯片分选机
Mini LED芯片分选机

Mini LED Wafer AOI Equipment

Product introduction


Equipment introductionThe Mini LED wafer AOI equipment is in the post-sorting stage, replacing the manual visual inspection of the sorted chip sources, and can achieve visual inspection of the sorted ...



Equipment introduction

    The Mini LED wafer AOI equipment is in the post-sorting stage, replacing the manual visual inspection of the sorted chip sources, and can achieve visual inspection of the sorted chips, and quickly and directly pick out the bad chips.

Equipment Highlights

①. Focus on detection: Our wafer inspection equipment focuses on detecting appearance defects, misalignment, skewed angles, floating crystals and other issues. By using advanced visual algorithms and image processing technology, these defects can be accurately identified and marked, helping the production line to discover and solve potential quality problems in time;


②. Quick selection of bad chips: The equipment is equipped with a high-speed picking robot arm. Once a defective chip is detected, it can quickly and accurately separate the bad chip from the wafer to ensure that only high-quality chips enter the next step of production. process. This can greatly improve production efficiency and reduce the inflow of bad products;


Replacement of quality inspectors: The testing equipment has the ability to fully replace the quality inspectors behind sorting. Through the automated detection and selection system, the demand for human resources is reduced, and it has advantages in accuracy and consistency, while reducing misjudgment and missed detection caused by human factors, and improving the efficiency and stability of the production line;


④. Detection efficiency doubled: By adopting advanced detection algorithm and high-speed image processing technology, compared with other visual inspection equipment on the market, the detection efficiency of this wafer detection equipment is doubled, thus improving the overall production efficiency And profits, greatly shorten the production cycle.


Application Scenario

Wafer: Compatible with 4-inch and 6-inch wafers, supporting mother and child rings and iron rings

Chip: Compatible with 2mil-80mil chips and packages

Non-destructive docking automatic loading and unloading



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