IC Chip Testing And Displacement Machine-Youngen Technology-Automated Smart Factory Solution Provider

Product introduction

The Thermo Stream System is a device that provide failure analysis and reliability test on chip in extreme temperature environment.

Equipment Highlights

High-Speed and High Efficiency: Can accommodate 4, 8, and 16 sites, and the maximum production capacity can reach 13.4K/hr.;
Stability and Reliability: The whole machine adopt our ultra-high-speed motion control technology, and the bus transmission is fast and reliable.
Free Expansion: Can choose from high / low temperature, CCD and other extended function modules

Basic Component

Loading Module: Transportation of Chip from the tray to the shuttle fixture

Material Shuttle Module: Transport of tested Chip to the pressure measurement and unloading module

Pressure Test Module: Transferring of Chip from material shuttle to testing position to complete the test

Defect Tray Module: Defective Chip storage area

Unload Module: Segregate Chips according to it test result into designated Bin tray

Loading Production Line: Transport full Chips to the loading position

Empty Tray Production Line: Collection and stacking of empty tray

Colored Tray Production Line: Place the colored tray for loading module, load/unload purpose

Unloading Production Line: Transport the full loaded tray to the manual pickup position and stack it

Tray Transfer Module: Responsible for empty tray handling

Scope of application

Chip Dimension: Package size compatible with 3*3~40*40 mm

Package Type: Suitable for TSOP/QFN/QFP/SIM Card/LGA/BGA/CSP and other package type chips

Test Content: DC Parameters test, Digital Functional test, AC Parameters test, ADC and DAC test, etc.

Parameter introduction

Description	Specification
Device model	FT400-N	FT800-N	FT1600-N
IC Package Category	TSOP/QFN/QFP/SIM Card/LGA/BGA/CSP	TSOP/QFN/QFP/SIM Card/LGA/BGA/CSP	QFP/TSOP/CSP/WLCSP/BGA/QFN/PLCC/LGA/PGA
Number Of Test Stations	4 Site（14,22）	8 Site（2*4）	16 Site（2*8）
Index Time	≤0.38S( Measurement pressure≤90 kgf )	≤0.4S( Measurement pressure≤90 kgf )	≤0.45S( Measurement pressure≤90 kgf )
Index Time	≤0.38S( Measurement pressure≤90 kgf )	≤0.5S( Measurement pressure≤160 kgf )	≤0.55S( Measurement pressure≤240 kgf )
UPH ( normal temperature )	9.5K (22 mode , 1435 Tray)	13.4K (24 mode , 1639 Tray)	13.4K (28 mode , 1639 Tray)
Failure Rate	≤ 1/10000	≤ 1/10000	≤ 1/10000
IC Package Size	3×3～40×40mm	3×3～40×40mm	3×3～25×25mm（16 Site）
High Temperature Mode	50℃~150℃±2℃	50℃~150℃±2℃	50℃~150℃±2℃
Pressure Measurement	90kgf	160kgf/240Kgf ( optional )	240kgf/480Kgf ( optional)
Stack / Orientation Detection	Sensor/CCD ( optional )	Sensor/CCD ( optional )	Sensor/CCD ( optional )
Test Site Interface	TTL,GPIB,RS232,TCP/IP	TTL, GPIB，RS232, TCP/IP	TTL, GPIB，RS232, TCP/IP
Equipment Size	1940 ( L ) * 1540 ( W ) * 2200 ( H ) ( without alarm light )	2040 ( L ) * 1580 ( W ) * 2200 ( H ) ( without alarm light )	2060 ( L ) * 1580 ( W ) * 2200 ( H ) ( without alarm light )
Weight	1000KG	1250KG	1500KG
Gas Source	0.4~0.6KPa、120L/min
Power Supply	AC220V 50HZ 、10KW

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