Equipment ModuleWafer Module：Carrying Wafer wafer, 4, 6 inches can be switchedBin Module：Bearing Bin sorting trayThimble Module：Separating the grains from the blue filmBin Island Module：Bonding Di...
Wafer Module：Capable of accommodating & interchange between 4, 6”Wafer
Bin Module：Bin sorting tray holder
Pin Ejector Module：Separating the DIE from the blue tape
Bin Island Module：Bonding of DIE to blue tape
PPX Module：Responsible for transferring of DIE from Wafer location to Bin location
CCD System：Scan & locate DIE
Wafer and Bin Magazine：Storage of Wafer and Bin tray
Loader Module：Pick and place Wafer trays and Bin sorting trays
Wafer：Compatible with 4-inch and 6-inch wafers；
Chip：Compatible with 3mil to 45mil Chips and packages
Bin：It can support up to 150 Bins, and supports the setting of independent empty and full Bin magazines；
Automatic loading and unloading
Description | Specification |
Bin Module | X axis: stroke 300mm , resolution 1μm Y axis: stroke 208mm , resolution 1μm Theta axis: stroke ± 15° , resolution 0.001° |
Wafer CCD | FOV: 6.8*5.4(mm) Resolution: 1282*1026 pixels Accuracy: 1/4 pixel |
Bin CCD | FOV: 6.8 *5.4(mm) Resolution: 1282 *1026 pixels Accuracy: 1/4 pixel |
Pin Ejector Module | Stroke: 2mm Resolution: 1μm |
Upper and lower plate module | X axis: stroke 930mm , resolution 1μm Y axis: stroke 300mm ; resolution 1μm Z axis: stroke 295mm , resolution 1μm |
Power Source | AC220V 50HZ 、10A |
Gas Source | Positive pressure: ≥ 0.5MPa , 10L/min Negative pressure: ≤ -75KPa , 38L/min |
Environment | Temperature: 25±5 ℃; Humidity: RH60±5% |
Description | Specification |
Capacity | Cycle time: 65ms, Overall capacity: 900K/day |
precision | XY θ：±20μm, ±3º@3σ |
Chip size | 4 thousand ~ 45 thousand |
Wafer Ring Sizes | 1. GR4(ID,OD = 140/152 mm) 2. GR5(ID,OD = 170/186 mm) 3. GR6 (ID, OD = 195/210 mm) 4. GR8 (ID, OD = 227/247 mm) |
Bin Size | 210*210 (mm) max； Working area: 80*80 (mm) or φ 100mm |
Maximum Bin Category | Up to 150 Bin ( 6*25bin/ box) |
Wafer Die Detectable Angle | ≤10º |
Yield | Scanning rate: > 99.97% Sorting yield: > 99.97% Alignment dilated rate: <0.03% Misalignment rate: ≤0.2% |
Die Force | 15g ~ 100g |
Wafer Module | X axis: stroke 310mm , resolution 1μm Y axis: stroke 206mm , resolution 1μm |
START A CONVERSATION
Phone